: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

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QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

QFP/IPM Series MGP Mold Product Description: MGP Mold - High-Quality Mold for Electronic Products MGP Mold is a highly efficient and durable mold designed specifically for chip packaging in electronic ...

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MGP Mould For Chip Packaging

MGP Mold For Chip Packaging

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